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XC7Z045-2FFG676I
AMD
BALL ROMless BOTTOM MCU FPGA System On Chip (SOC) IC -40C~100C TJ 256KB 800MHz 1V
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Product Specifications for XC7Z045-2FFG676I
Type
Spec
Case/Package
BGA
Contact Plating
Copper, Silver, Tin
Core Architecture
ARM
Data Bus Width
32 b
Height - Seated (Max)
3.24 mm
Interface
CAN, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Length
27 mm
Max Operating Temperature
100 °C
Max Supply Voltage
1.03 V
Memory Type
ROMless
Min Operating Temperature
-40 °C
Min Supply Voltage
950 mV
Nominal Supply Voltage (DC)
1 V
Number of Inputs
378
Number of I/Os
130
Number of Logic Blocks (LABs)
27325
Number of Logic Elements/Cells
350000
Number of Outputs
378
Number of Terminals
676
Operating Supply Voltage
1 V
Peripherals
DMA
Radiation Hardening
No
REACH SVHC
Unaffected
RoHS
Compliant
Speed Grade
-2
Terminal Pitch
1 mm
Width
27 mm