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XC7Z0452FFG676I
Xilinx
BALL ROMless BOTTOM MCU FPGA System On Chip (SOC) IC -40C~100C TJ 256KB 800MHz 1V
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Product Specifications for XC7Z0452FFG676I
Type
Spec
Case/Package
FCBGA
Contact Plating
Copper, Silver, Tin
Core Architecture
ARM
Data Bus Width
32 b
Frequency
800 MHz
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Frequency
733 MHz
Max Operating Temperature
100 °C
Memory Type
ROMless
Min Operating Temperature
-40 °C
Number of I/Os
130
Operating Supply Voltage
1 V
Peripherals
DMA
Radiation Hardening
No
RoHS
Compliant
Speed Grade
-2